Ever since I wired up the heated build plate and extruder hot end to my RepRap, I’ve wanted to verify the thermal temperatures and heat distribution. For starters, I have used a cheap infrared thermometer, which is fine for verifying the temperatures, but not very well suited for verifying heat distribution.
Last week, I got my hands on a Fluke Ti25 Thermal Imager – perfect for getting a good look at the heat distribution!
My heat bed is a sandwich with Josef Prusa’s PCB heat bed on the bottom and a 4 mm glass plate covered in kapton on the top. My thermistor for sensing the temperature of the heat bed is taped to the bottom side of the PCB. As shown by the image below, the glass plate does a good job of evening out the heat from the PCB.
However, I was surprised to see how much the temperature of the kapton-covered glass surface lacks behind the temperature on the bottom side of the PCB (which, incidentally, is where my thermistor is placed). On the image above, the top is 85.8 C while the heat reflection by the bottom alu plate reads 92.8 C – nearly the same temperature sensed by my thermistor at that time. The top glass surface catches up to the bottom temperure eventually, but it takes as long as 5 minutes for it to become stable. This explains why some of my prints have had a hard time sticking to the heated build plate – it simply wasn’t warm enough, when I started the print.
The image above is of my extruders hot end, a 0.5 mm J-head MkII (or should that be 0.4572 mm?). Again, I was quite surprised by the thermal imaging – the heater resistor goes as high as 302.3 C when heating the nozzle to 200 C! That’s quite a lot more than I would have expected – good thing I’ve used cement that can withstand 1100 C for gluing in the thermistor and resistor.
Finally, the image above is of my RAMPS 1.4, which has small EnzoTech MOS-C1 heatsinks mounted on all the Allegro A4988 stepper drivers. Notice how cool the heatsinks are – and notice how hot the PCB gets. Good thing those heatsinks were cheap…